Описание
Процессор AMD Phenom II HMN830DCR32GM
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Market segmentMobileFamily
AMD Phenom II Triple-Core MobileModel number ? N830CPU part number
— HMN830DCR32GM is an OEM/tray microprocessor
Stepping codesAADHC AD NADHC ADFrequency ? 2100 MHzBus speed ? One 1800 MHz 16-bit HyperTransport link (3.6 GT/s)Clock multiplier ? 10.5Package638-pin lidless organic micro Pin Grid Array (UOL638)AMD Package number30605SocketSocket S1 (S1g4)Size1.38" x 1.38" / 3.5cm x 3.5cmWeight0.2oz / 5.7g (measured)
0.2oz / 6.5g (by specifications)Introduction dateMay 12, 2010End-of-Life dateLast order date is 3rd quarter 2011
Last shipment date is 1st quarter 2012Architecture / MicroarchitectureMicroarchitectureK10PlatformDanubeProcessor core ? ChamplainCore stepping ? BL-C3CPUID100F53Manufacturing process0.045 micron silicon-on-insulator (SOI) technologyData width64 bitThe number of CPU cores3The number of threads3Floating Point UnitIntegrated, 128-bit wideLevel 1 cache size ? 3 x 64 KB 2-way set associative instruction caches
3 x 64 KB 2-way set associative data cachesLevel 2 cache size ? 3 x 512 KB 16-way set associative cachesLevel 3 cache sizeNoneCache latency [1]3 (L1 cache)
15 (L2 cache)MultiprocessingUniprocessorExtensions and Technologies
— MMX instructions
— Extensions to MMX
— 3DNow! technology
— Extensions to 3DNow!
— SSE / Streaming SIMD Extensions
— SSE2 / Streaming SIMD Extensions 2
— SSE3 / Streaming SIMD Extensions 3
— SSE4a ?
— AMD64 / AMD 64-bit technology ?
— EVP / Enhanced Virus Protection ?
— AMD-V / AMD Virtualization technology
Low power features
— PowerNow!
Integrated peripherals / componentsIntegrated graphicsNoneMemory controllerThe number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1333, DDR3L-1066
Maximum memory bandwidth (GB/s): 21.3Other peripherals
— HyperTransport technology 3.0
Electrical / Thermal parametersThermal Design Power ? 35 Watt
Дмитрий